Partner story | Etteplan at Semicon09
Etteplan: Leading Photonic Integration and
Equipment Development in Semicon 09
Etteplan, a renowned engineering service provider, brings its extensive expertise in technology development to the Semicon 09 project, focusing on high-precision equipment for photonic integrated chip (PIC) packaging. Led by Engineering Manager Niels Jansen, Etteplan plays a vital role in advancing a modular machine platform that enhances the flexibility, precision, and configurability of photonic packaging solutions.
Project background:
NXTGEN Inlite (Inspiring Novel Light-Integrated Technology & Equipment)
In this project, efforts are focused on developing production equipment for integrated photonics to enable mass production of these components and devices. The project concentrates on standardizing both front-end and back-end production processes for manufacturing wafers with Photonic Integrated Circuits. The goal is to develop machines for various product families that utilize standard substrates such as SiN and InP. These developments are crucial for assembling the components, integrating various coupling methods. Additionally, the project seeks to advance new process developments in techniques such as PLD and CVD.
Role in Semicon09
Through new software packages andinn ovative systems engineering, Etteplan aims to elevate photonic technology to a higher Technology Readiness Level (TRL), making PIC integration easier and more efficient for a wide range of applications.
Completed activities
Etteplan has achieved several initial milestones that lay the groundwork for advanced photonic integration capabilities in Semicon 09.
Key activities completed include:
Development of software packages that enhance the flexibility and configurability of Etteplan’s existing equipment, setting the stage for future advancements.
Design of back-end equipment optimized for sub-micron accuracy, supporting the precise placement of PICs in carriers with integrated waveguides.
Creation of preliminary systems that facilitate PIC integration across various chip positions, achieving seamless light transmission without grating couplers.
Future activities
Etteplan has outlined a roadmap to drive further advancements in PIC packaging and integration, aiming for significant milestones by 2030:
Conduct trial tests for the new modular machine platform by the end of 2024, assessing initial performance and alignment precision.
Develop the equipment/technology building blocks able to assemble a photonic PCB capable of combining multiple small PICs with known functionalities into larger, integrated optical circuits.
Enhance the equipment to support multi-platform PIC integration, allowing diverse photonic functionalities to be packaged into a single, large optical circuit.
Etteplan expertise
Etteplan’s expertise in precision engineering, sub-micron alignment, and software development makes it a valuable partner in the Semicon 09 project. The company’s experience in building high-precision systems and their in-house capabilities in both mechanical and software engineering allow Etteplan to navigate the complex challenges of PIC packaging with ease. By leveraging its knowledge of sub-micron alignments and modular machine platform design, Etteplan is uniquely equipped to support the integration of multiple PICs within a single circuit. This innovative approach reduces the error rates commonly associated with complex optical paths, ensuring high-quality functionality across integrated photonic platforms.
Etteplan’s contributions go beyond equipment development; they are d riving a shift towards multi-functional photonic circuits that combine tested functionalities into a cohesive whole. This solution not only facilitates more efficient integration of photonic chips but also paves the way for new applications in telecommunications, data centers, and beyond. Through their commitment to innovative thinking and seamless integration, Etteplan is helping to establish a robust, scalable ecosystem for photonic technology.
Conclusion
With a foundation of technical excellence and a commitment to advancing photonic integration, Etteplan is shaping the future of PIC packaging and integration within Semicon 09. Through precision engineering, software innovation, and a modular approach, Etteplan is contributing essential technology that enables seamless photonic functionality at scale. By fostering collaboration within NXTGEN Hightech, Etteplan is ensuring that photonic technology continues to grow in alignment with the evolving needs of the high-tech ecosystem, making them an indispensable partner in the journey towards a fully integrated photonic future.