Partner story | LioniX International at Semicon09
LioniX International: Advancing Photonic Integration in Semicon 09 through expertise and innovation
As a key player in the field of integrated optics and customized microfabrication, LioniX International brings extensive experience and capabilities to the Semicon 09 project. Situated near the high-tech Nanolab cleanroom in Enschede, LioniX International is uniquely positioned to support the photonic integrated circuit (PIC) needs of OEM customers, system integrators, and research institutions.
Project background:
NXTGEN Inlite (Inspiring Novel Light-Integrated Technology & Equipment)
In this project, efforts are focused on developing production equipment for integrated photonics to enable mass production of these components and devices. The project concentrates on standardizing both front-end and back-end production processes for manufacturing wafers with Photonic Integrated Circuits. The goal is to develop machines for various product families that utilize standard substrates such as SiN and InP. These developments are crucial for assembling the components, integrating various coupling methods. Additionally, the project seeks to advance new process developments in techniques such as PLD and CVD.
Role in Semicon09
Within the Semicon 09 program, LioniX leads efforts to develop and validate advanced PICs that are essential for testing and refining assembly processes. Their work focuses on establishing standardized test and assembly methods, addressing the industry’s lack of standardized protocols and fostering greater efficiency and scalability in PIC manufacturing.
Completed activities
LioniX International has already made significant strides in the Semicon 09 project, contributing a range of test structures and methodologies that advance assembly capabilities for PICs.
Key activities completed so far include:
Fabrication of initial test structures to evaluate flip-chip methodologies and soldering techniques.
Distribution of test structures to project partners for collaborative testing and feedback.
Implementation of feedback-driven refinements to enhance the functionality and complexity of the test structures, enabling more accurate assessments of assembly strategies.
Future activities
Looking forward, LioniX International has outlined several activities essential for further advancing PIC assembly and testing methodologies:
Continue refining and expanding the range of test structures based on partner feedback.
Develop additional packaging techniques, including etched recesses with solder for flip-chip integration of active components (e.g., laser diodes and detectors).
Implement and standardize wafer-level testing approaches using grating couplers and flexible waveguides.
Expand wafer-level packaging capabilities to enhance scalability and reliability in photonic assembly.
LioniX International expertise
LioniX International’s vertically integrated model gives the company a unique edge in the Semicon 09 project. With over two decades of expertise in PIC foundry services, LioniX has honed its skills across all stages of the photonic development process. This includes architecture design, chip design and manufacturing, testing, packaging, and assembly, along with control electronics and software. This integrated approach allows LioniX to collaborate effectively with partners and address various aspects of photonics, offering insights that enhance project outcomes. Their multidisciplinary engineering team is adept at translating complex challenges into streamlined, scalable solutions that are essential for the continued growth of the photonics industry.
LioniX’s commitment to standardizing testing and assembly processes and their deep expertise make them an indispensable partner in Semicon 09. By working closely with other project collaborators, LioniX aims to elevate the industry’s readiness for high-volume PIC manufacturing, ensuring the necessary infrastructure and protocols are in place for future scalability.
Conclusion
LioniX International’s contribution to the Semicon 09 project is setting a new standard for PIC assembly and testing methods. Their vertically integrated expertise enables them to tackle challenges from multiple perspectives, ensuring robust solutions that align with the evolving demands of the photonics ecosystem. With LioniX at the forefront, Semicon 09 is making strides toward a standardized, scalable approach to PIC manufacturing, positioning the industry for significant growth and innovation in the coming years.