Partner story | TU Delft at Semicon09
TU Delft: Driving Advanced Packaging Solutions
in Semicon 09
TU Delft, renowned for its cutting-edge research in semiconductor and photonics technologies, plays a crucial supporting role in the Semicon 09 project, partnering with CITC to advance packaging solutions for next-generation integrated photonics.
Project background:
NXTGEN Inlite (Inspiring Novel Light-Integrated Technology & Equipment)
In this project, efforts are focused on developing production equipment for integrated photonics to enable mass production of these components and devices. The project concentrates on standardizing both front-end and back-end production processes for manufacturing wafers with Photonic Integrated Circuits. The goal is to develop machines for various product families that utilize standard substrates such as SiN and InP. These developments are crucial for assembling the components, integrating various coupling methods. Additionally, the project seeks to advance new process developments in techniques such as PLD and CVD.
Role in Semicon09
Within the Electronic Components, Technology, and Materials (ECTM) group, TU Delft is focused on developing innovative packaging techniques, particularly the Flip-Chip assembly with an embedded heater substrate, for photonic integrated circuits (PICs). This collaboration aims to address the industry’s demands for compact, high-density photonic packaging that is both efficient and reliable.
Completed activities
TU Delft has made substantial progress in advancing photonic packaging solutions as part of its role in Semicon 09.
Key activities completed so far include:
Definition and conceptualization of a “Moonshot” package in collaboration with CITC, establishing processes for assembly and packaging of photonic dies.
Development of the foundational Flip-Chip assembly process to support high-density connections in photonic circuits.
Preliminary work on the Nano-silver sintering process, laying the groundwork for high-performance electrical connections within photonic assemblies.
Future activities
TU Delft’s planned activities are set to further refine and implement the advanced packaging solutions necessary for future photonic applications. Key upcoming tasks include:
Completion and optimization of the Flip-Chip assembly process, ensuring efficient, high-density integration within photonic devices.
Development and testing of the Nano-silver sintering process on the embedded heater substrate, enabling lower-temperature sintering that preserves the integrity of sensitive components.
Continued collaboration with CITC and other NXTGEN Hightech partners to enhance packaging techniques that meet the evolving demands of the photonics industry.
TU Delft expertise
TU Delft’s extensive expertise and state-of-the-art facilities make it an invaluable partner in Semicon 09. The ECTM group, TU Delft’s largest research group focused on semiconductor packaging, offers a multidisciplinary environment with strong industrial connections. With access to advanced semiconductor equipment in both the EKL and Kavli cleanrooms, TU Delft has the resources needed to develop and refi ne the embedded heater substrate for photonic packaging. This substrate, integral to the Flip-Chip assembly, provides an innovative solution by allowing heat to be generated locally for the Nano-silver sintering process, circumventing the need for high temperatures that could damage sensitive photonic components.
TU Delft’s focus on innovative materials, microstructures, and integration techniques has long supported applications in health, energy, and environmental sensing. This deep foundation in advanced packaging and nanofabrication enables TU Delft to offer unique insights into photonic packaging challenges, including efficient heat management and high-density integration. By combining these capabilities, TU Delft is not only advancing the technology required for photonic integration but also ensuring that the packaging solutions developed are sustainable and adaptable for future photonics applications.
Conclusion
As a key partner in the Semicon 09 project, TU Delft is pioneering advanced packaging solutions that promise to transform photonic integration. Through its collaborative work on the Flip-Chip assembly with an embedded heater substrate, TU Delft is helping to address the technical challenges that limit current photonic packaging, setting the stage for more compact, efficient, and scalable solutions.
By leveraging its cleanroom facilities and the expertise of the ECTM group, TU Delft is contributing essential technology that will shape the future of photonics, making it a critical partner in the NXTGEN Hightech initiative.