Semicon 05: Deposition and printing for heterogeneous assembly

This project focuses on advancing microelectronics packaging through novel additive manufacturing technologies that enable high-resolution and scalable integration at high throughput. As conventional methods face limitations in handling and integrating micron-sized components with sub-micron precision and speed, Semicon 05 is developing a component integration platform based on Laser-Induced Forward Transfer (LIFT). This same platform is also used to form interconnects between components and circuitry on the target substrate. A second manufacturing platform under development is 3D Printed Microelectronics (3DPME), which enables the integration of electronics within complex structures at resolutions currently unachievable with traditional PCB technologies.

LIFT is a precision, non-contact technique that transfers functional materials and components onto diverse surfaces, including flexible and stretchable substrates, with sub-micron accuracy. It supports high-density integration and is well-suited for heterogeneous assembly. In parallel, 3DPME enables direct, maskless printing of conductive, dielectric, and structural materials, allowing embedded functionality within three-dimensional substrates. Together, these technologies offer a digital, sustainable approach to packaging, supporting miniaturization, design freedom, and integration of advanced features.