Semicon 05: Deposition and printing for heterogeneous assembly

This project focuses on improving chip packaging techniques crucial for the functioning of chips in applications such as electric vehicles and 5G technology. With the increasing complexity and functionality requirements of chips, traditional assembly and packaging methods often no longer suffice. Additive manufacturing, already more advanced in sectors like automotive and healthcare, now also offers possibilities for the semiconductor industry.

The project will concentrate on addressing fundamental issues within the chip packaging industry by applying these advanced additive manufacturing technologies.