Recap | Semicon domain meeting - 4th December
On December 4, the NXTGEN Hightech Semiconductors Meeting took place at Salland Engineering in Zwolle and it was a success! This inspiring meeting brought the project leaders and partners of the different projects together to share progress and innovations within the semiconductor domain.
Highlights included:
Paul van Ulsen (Salland Engineering), who shared the history about the company, showcased the latest advancements and its contribution to the NXTGEN Hightech program.
Gerard Rauwerda (Technolution), presented breakthroughs in high-precision (nano) metrology systems for integrated circuits and diagnostics.
The (nano) metrology systems' project aims to develop better metrology instruments for high-precision fabrication of integrated circuits (ICs), photonic integrated circuits (PICs), or accurate high-precision diagnostics of biological tissues. Therefore, we aim to understand and improve the synergies and interplay between high-speed data acquisition techniques, machine control concepts and information extraction techniques.Jan Driessen (ITEC), who presented cutting-edge chip assembly systems based on contactless force field technology.
ITEC is working with partners TNO-Holst, Sioux and TUE on new chip assembly systems based on force field technology. The goal is to set up traditional mechatronic process steps with contactless handling based on precisely controlled force fields and in this way to assemble semiconductor products energy-efficiently, cheaply and fully digitally controllable.Jacqueline van Driel (TNO), highlighted innovative additive manufacturing technologies for semiconductors.
The presentation of Jacqueline highlighted the development of multiple additive manufacturing technologies. Laser-based printing technologies for printing interconnect materials and electronic components, drastically increasing print speeds and resolution. And also 3D printing of complete semiconductor electronics, from chip packages to chip test modules.Matthijn Deckers (LAM Research/Solmates), shared advancements in Pulsed Laser Deposition (PLD) technology, pushing the boundaries of mass production.
Pulsed Laser Deposition (PLD) enables next generation applications within the “specialty technology” domain. Recently the newest generation of the Solmates/Lam PLD equipment has been launched. The current state-of-the-art of PLD technology will be presented. Within project semicon-01, the technology is pushed beyond the state-of-the-art, maturing PLD for mass production.
With engaging discussions and invaluable networking, this meeting reinforced the collective drive to innovate within the semiconductor sector.