Semicon01 focuses on developing advanced manufacturing technology for Radio Frequency (RF) components for 5G/6G and base stations. The project aims to develop Pulsed Laser Deposition (PLD) machines suitable for high-volume production of integrated filters. This technology is intended to replace conventional deposition systems, improve production efficiency, and enhance component performance. The end result is a disruptive technology for the production of 5G/6G components, contributing to significant cost reductions and enabling commercial scalability.

The NXTGEN Chip Assembly Equipment project focuses on developing advanced technologies and process flows for the next generation of chip assembly equipment, which needs to be more efficient, precise, and cost-effective. In the Netherlands, traditionally strong in the production and assembly of semiconductors, there is an urgent need for innovation to meet growing market demand and address shortcomings of current systems, such as limited productivity and high energy consumption. This project aims for a paradigm shift by integrating contactless handling with precisely controlled force fields, enabling an energy-efficient and fully digitally controllable chip assembly.

Semicon05 focuses on improving chip packaging techniques crucial for the functioning of chips in applications such as electric vehicles and 5G technology. With the increasing complexity and functionality requirements of chips, traditional assembly and packaging methods often no longer suffice. Additive manufacturing, already more advanced in sectors like automotive and healthcare, now also offers possibilities for the semiconductor industry. The project will concentrate on addressing fundamental issues within the chip packaging industry by applying these advanced additive manufacturing technologies.

In Semicon09, efforts are focused on developing production equipment for integrated photonics to enable mass production of these components and devices. The project concentrates on standardizing both front-end and back-end production processes for manufacturing wafers with Photonic Integrated Circuits. The goal is to develop machines for various product families that utilize standard substrates such as SiN and InP. These developments are crucial for assembling the components, integrating various coupling methods such as vertical and horizontal. The project also aims at new process developments in the front-end part for properties such as PZT and CVD.