Overview of our projects

Semicon 01

Process optimization for high TRL & high MRL PLD

Semicon01 focuses on developing advanced manufacturing technology for Radio Frequency (RF) components for 5G/6G and base stations. The project aims to develop Pulsed Laser Deposition (PLD) machines suitable for high-volume production of integrated filters. This technology is intended to replace conventional deposition systems, improve production efficiency, and enhance component performance. The end result is a disruptive technology for the production of 5G/6G components, contributing to significant cost reductions and enabling commercial scalability.

This project aims to develop new system architectures for high-tech equipment in the semiconductor industry. It focuses on improving equipment performance to meet industry roadmap requirements and support the continuous improvement of Moore's Law. By investing in innovation of foundational technologies, particularly in mechatronics and systems engineering, this leadership role is maintained and further expanded. This project promotes multi-disciplinary knowledge building and integrates new design methods and materials to enhance future equipment performance.

Semicon 02

Next Generation High Tech System architectures

Semicon 03

NXTGEN chip assembly equipment

The NXTGEN Chip Assembly Equipment project focuses on developing advanced technologies and process flows for the next generation of chip assembly equipment, which needs to be more efficient, precise, and cost-effective. In the Netherlands, traditionally strong in the production and assembly of semiconductors, there is an urgent need for innovation to meet growing market demand and address shortcomings of current systems, such as limited productivity and high energy consumption. This project aims for a paradigm shift by integrating contactless handling with precisely controlled force fields, enabling an energy-efficient and fully digitally controllable chip assembly.

This project is dedicated to developing advanced metrology systems to accelerate and enhance high-tech processes such as the fabrication of integrated circuits and precision diagnostics of biological tissues. It focuses on integrating systems for parallel data acquisition, which necessitates the processing and storage of large data streams. The project aims to automate and optimize workflows in laboratories and production environments to increase efficiency. Key areas include the development of faster and more accurate metrology systems, creating optimized workflows, and improving data analysis techniques to derive actionable insights from complex datasets.

Semicon 04

(nano) Metrology systems

Semicon 05

Deposition and printing for heterogeneous assembly

Semicon05 focuses on improving chip packaging techniques crucial for the functioning of chips in applications such as electric vehicles and 5G technology. With the increasing complexity and functionality requirements of chips, traditional assembly and packaging methods often no longer suffice. Additive manufacturing, already more advanced in sectors like automotive and healthcare, now also offers possibilities for the semiconductor industry. The project will concentrate on addressing fundamental issues within the chip packaging industry by applying these advanced additive manufacturing technologies.

Within this project, two machines are being developed to test integrated photonic chips with the aim of becoming a global leader in visual and prober test equipment for integrated photonics as part of the consortium. Three generations of machines are being developed in which fundamental research is transformed into working machines.

Semicon 08

Metrology Equipment for critical scaling of PIC Production

Semicon 09

Production Equipment for high volume PIC Production

In Semicon09, efforts are focused on developing production equipment for integrated photonics to enable mass production of these components and devices. The project concentrates on standardizing both front-end and back-end production processes for manufacturing wafers with Photonic Integrated Circuits. The goal is to develop machines for various product families that utilize standard substrates such as SiN and InP. These developments are crucial for assembling the components, integrating various coupling methods such as vertical and horizontal. The project also aims at new process developments in the front-end part for properties such as PZT and CVD.

This project not only focuses on the technical development of advanced devices but also on an effective market approach for new customers and value chains. A significant part of the project is expanding the level of knowledge to parties outside the current project. Knowledge sharing and reaching new customers by creating new control points in value chains are central themes in work package 10.

Semicon 10

Ecosystem project

Want to know more about our projects in the semiconductors domain?

Program Manager Ivan Stojanovic will tell you everything about it.