Blog | How lasers are enabling the next step in chip packaging
Laser manipulation as the basis for new packaging technology
Lasers have long since ceased to be used in the high-tech manufacturing industry just for cutting, engraving or measuring. Within NXTGEN Hightech Semicon 3 and Semicon 5, we are investigating how laser-based processes can contribute to a new generation of chip assembly and packaging. Think of contactless die-transfer, laser bonding and additive printing processes for heterogeneous assembly: technologies that allow us to build chip packaging more precisely, flexibly and efficiently.
In addition, there is a direct link with Semicon 2: Next Generation High Tech System Architectures. Semicon 2 focuses on the underlying system architectures for high-tech equipment. From that project, knowledge about optics and galvo laser control, mechatronics, integrated control and system integration come together. It is precisely this combination that is needed to enable new laser-based processes to function reliably in machine systems with unmatched productivity, super-fast micron-precision positioning and minimal wear.
This development comes at an important time. Chip packaging is becoming increasingly complex and the sector is moving towards heterogeneous integration. This brings together various components, materials and functions in one powerful and energy-efficient microchip packaging. This requires production technology that is accurate and flexible, but also scalable enough for industrial volume production. At the same time, there is a growing need for new process technologies that reduce energy consumption and material loss and make more efficient use of machines and plant space.
The relationship between Semicon 2, 3 and 5
The three projects each have their own focus. Semicon 2 lays the foundation for system architecture and high-tech equipment. Semicon 3 translates laser-based assembly processes into machine development. Semicon 5 develops new deposition and printing processes for heterogeneous assembly. The three projects collectively bring the synergy between laser-based processes, machine development and the next generation of microchip packaging closer to industrial applications.
From laser process to working machine system
Within the Semicon03 consortium, with ITEC as project leader, TNO, Sioux and Eindhoven University of Technology are working together on the next generation of equipment for laser-based chip assembly. ITEC focuses on the development of new assembly equipment for the industrial market. TNO contributes expertise in laser-based processes. Sioux supports the module development of the machine and Eindhoven University of Technology conducts pioneering research into the symbiosis between hardware and software in complex cyber physics systems (CPS). From Semicon 2, this is supplemented with knowledge about system architecture, optics, precision positioning, mechatronics and integrated control.
At the heart of this development is the shift from primarily mechanical assembly processes to laser-based processes and non-contact handling. That step requires more than just a good laser process. It is precisely the combination of assembly technology, process knowledge, module development, software and system architecture that determines whether the technology can function as one stable and reliable machine system.
The focus is now on bringing together and validating the components. Laser processes, moving modules, control software, data and inspection must be precisely coordinated. Within the joint efforts of Semicon 2, 3 and 5, we are working on an Alpha tool for laser-based transfer, among other things. This is a step towards an integrated machine platform in which process, machine and system architecture are developed as a whole.
New routes for heterogeneous assembly
Within the Semicon05 consortium, with TNO as project leader, ITEC B.V., NXP Semiconductors Netherlands B.V., Keiron Printing Technologies B.V., AMSystems B.V., Eindhoven University of Technology and the University of Twente are working together on deposition and printing techniques for heterogeneous assembly. TNO brings together knowledge about new production routes and process development. The Holst Centre, part of TNO, is also relevant here as a separate innovation environment. This is where knowledge about microelectronics, flexible electronics and new production processes come together. The partners contribute from their own expertise to the development, validation and application of additive processes, material deposition, interconnections and microcomponents.
The image shows how Semicon 5 compares to Semicon 2 and Semicon 3. Where Semicon 3 mainly focuses on the machine side of chip assembly, Semicon 5 focuses on new deposition and printing processes for heterogeneous integration. This allows materials and components to be applied in exactly the right place. This is directly in line with the need for compact, reliable packages in which different functions, materials and components come together.
In this way, Semicon 5 connects directly to the machine development in Semicon 3 and the system architecture from Semicon 2. The challenge is not only to make a process technically feasible, but also to translate the process into a reproducible and scalable production step for future high-tech equipment.
Less waste as a design principle
What connects Semicon 3 and 5 is the pursuit of precision manufacturing with less waste. Non-contact laser processes can reduce wear and maintenance. Additive processes make it possible to apply material only where it is needed. And as processes become more accurate and stable, this can contribute to less downtime and a more efficient use of energy, materials and production capacity.
Circularity is therefore not separate from technology. It is woven into the way we design production processes: with less mechanical contact, less material loss, lower energy consumption per operation and better utilization of machines and factory space. Especially in semiconductor manufacturing, such process improvements can have a significant impact on a large scale.
The next step: testing in practice
The next phase is all about further validation. For Semicon 3, this means that laser-based assembly steps and machine parts are further tested and brought together towards an integrated machine platform. For Semicon 5, the focus is on the further development of deposition and printing processes that are reliable and scalable enough for heterogeneous assembly. Semicon 2 remains relevant in this context as a project in which the underlying system architectures, optics, mechatronics and control principles for high-tech equipment are developed.
The step towards application is central to this. Which processes are the most promising from a technical point of view? Where are the greatest industrial needs? And how can we use demonstrators to show what these technologies make possible in practice?
With Semicon 2, 3 and 5, we are building production technology for the microchip packaging of tomorrow within NXTGEN Hightech. Not only by producing faster or more accurately, but also by rethinking the production process itself: contactless where possible, additive where it adds value and scalable enough for future high-tech equipment.
Are you active in semiconductor packaging, heterogeneous integration, optics, mechanical engineering or additive manufacturing? Then we would like to get in touch with you to investigate how these technologies can be further developed and scaled up.