Semicon 03: NXTGEN chip assembly equipment

The NXTGEN Chip Assembly Equipment project focuses on developing advanced technologies and process flows for the next generation of chip assembly equipment, which needs to be more efficient, precise, and cost-effective. In the Netherlands, traditionally strong in the production and assembly of semiconductors, there is an urgent need for innovation to meet growing market demand and address shortcomings of current systems, such as limited productivity and high energy consumption.

This project aims for a paradigm shift by integrating contactless handling with precisely controlled force fields, enabling an energy-efficient and fully digitally controllable chip assembly.